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A large number of those features have now returned and been improved. Another way this operating system is different is because Windows 10 is a free download for the first year. Microsoft has also pledged to support the operating system as long as it is running on a current device. These are dramatic departures from previous Microsoft policies/5. Jan 08,  · Windows 10 is not free if you are running Windows 8 or earlier or your computer doesn’t have a license installed at all. If all you need to the installation files for Windows 10, here is how you get them: What you should do, is first download the ISO file using Media Creation Tool, then use another tool such as Rufus to make a bootable copy. Download Windows 10 Disc Image (ISO File) Before updating, please refer to the Windows release information status for known issues to confirm your device is not impacted.
 
 
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Der8auer began to grind off “extra” silicon from the Core i9-7920X
31.05.20221 [10:00],
Ivan Grudtsyn

Support from partner companies and voluntary donations help engineer and overclocker Roman “Der8auer” Hartung to find time and money for new daring projects. In the past, the German enthusiast has repeatedly “scalped” processors with a soldered lid, and now he decided to go further, starting to grind the CPU crystal itself. The test was a 12-core Intel Core i9-7920X (Skylake-X) chip for the LGA2066 platform. In Germany, its minimum cost is € 1,040, and in the domestic market – 69,500 rubles.

The heat distribution cover was previously removed from the processor

Roman’s goal was to grind off part of the Skylake-X crystal to align it. As shown by measurements of the thickness of the processor without a cover, its central part is raised relative to the corners by up to 40 microns. Due to this feature, a larger layer of thermal paste is required, which impairs thermal conductivity.

Skylake-X crystal thickness without PCB – 0.78 mm

The blocks that make up the processor are located on the side of its PCB, while the insulating layer of silicon nitride (about half the thickness of the die) is on the outside. Removing a protective layer with a thermal conductivity of 1.5-5 times worse than that of silicon, carries the risk of damaging the CPU. Moreover, this can happen not so much during its polishing as during further operation, especially if liquid metal is applied to the polished surface to ensure better thermal conductivity. Despite the risk, Roman grinded off from 4.4 to 10% of the crystal, aligning it at about 0.72 mm (with textolite – 3.64 mm). The whole process took several hours, during the experiment we used a 3M polishing film based on aluminum oxide (40 μm particles), and then a diamond (9 μm). Der8auer resorted to Cleaner 601 aerosol to cleanse the polished crystal.

Roman’s ultimate goal is to grind off half of the Core i9-7920X die to almost completely get rid of silicon nitride, take temperature measurements and probably overclock the processor under liquid nitrogen. In the meantime, the German specialist limited himself to overclocking only a slightly worn chip. Using the ASUS Rampage VI Apex (LGA2066 / X299) motherboard and EK Water Blocks LSS with a 240 mm radiator, the processor got rid of the ~ 60 μm silicon nitride layer to 4.2 GHz. Note that the external CPU heat-distributing cover was returned to its place, and the thermal interface was the liquid metal Thermal Grizzly Conductonaut.

The result of a simple die alignment of the Core i9-7920X is encouraging: the temperature of the hottest core dropped by 2 ° C, and the temperature of the coldest – by 5 ° C. Der8auer does not recommend conducting such experiments at home, moreover, even the world’s leading overclockers will find it difficult to decide on direct processing of a CPU crystal costing a full-fledged gaming PC. For more details, see the video on Roman’s channel.

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