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American and Dutch companies will jointly create equipment for the production of microcircuits from chiplets
24.10.2021 [20:00],
Gennady Detinich

Numerous news of recent years about the improvement of technologies for multichip packaging of chips more clearly says that further the notorious Moore’s law will be observed with amendments for the spatial layout of microcircuits. But for this to happen, industrial equipment manufacturers must have their say. And Applied Materials and BE Semiconductor Industries were among the first to join the development process.

Conventional place of connection of two independent crystals by the “contact to contact” method. Image source: Applied Materials

Recently, the American Applied Materials and the Dutch BE Semiconductor Industries (Besi) announced the creation of a joint development group for technological processes and industrial plants to ensure the commercial operation of technologies for hybrid connection of crystals (chiplets) in multichip layouts.

“The hybrid uses direct copper-to-copper interconnects to increase I / O density while reducing wiring between chiplets, which improves overall performance, reduces power and costs,” Applied Materials said in a press release.

Hybrid interconnection creates electrical contacts between multiple die-cut chiplets using direct copper interconnects. This is not the only method of joining crystals, but it is believed that one of the most effective. According to the developers, such connections will allow several dissimilar crystals to work no worse and even better than if they were made on one monolithic piece of silicon. Obviously, this is at least true from the point of view of reducing the level of scrap and from the point of view of reducing the lengths of conductors, and this is heat generation, consumption and other disadvantages of large-area crystals.

The process and manufacturing equipment development program will be implemented by joint engineering teams from both companies at the Applied Materials Packaging Excellence Center in Singapore. Claimed to be the industry’s leading R&D center.

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