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TSMC to help Google and AMD design chips with 3D layout
It is not the first year that AMD has been using multichip layout in the creation of its central processors, and in the segment of graphics processors, it began to use HBM memory for a long time. In the future, AMD products are expected to move to a more complex spatial arrangement, with the Taiwanese company TSMC becoming the main partner on this path.
Image source: AMD
Nikkei Asian Review, citing knowledgeable sources, said TSMC plans to adapt 3D spatial layout technologies for the needs of Google and AMD. To this end, a new facility is already under construction in the city of Miaoli in northwest Taiwan, which will begin packaging chips for select customers in 2022. AMD and Google strive to be the first TSMC customers in this area, and therefore are already actively cooperating with a Taiwanese partner.
If in the case of AMD everything is clear enough – the company does not want to lag behind Intel in the development of spatial layout, then Google’s participation in such an initiative may come as a surprise to many. According to the source, the American Internet giant plans to commission TSMC to produce chips of its own design for automotive autopilot systems, and these chips will use a complex spatial layout to increase the density of integration of elements.
Apple and NVIDIA are mentioned among other potential customers of TSMC in this area. TSMC officials have already announced at the last quarterly conference that the share of revenue from the provision of packaging services for semiconductor components in the coming years will increase.
TSMC competitors do not sit idly by either. If Intel and Samsung are going to use the spatial layout mainly for their own needs, then the Chinese SMIC is making attempts to develop in this direction in order to serve its customers. Naturally, the sanctions imposed by the United States against this company will significantly complicate the implementation of this task.
Apple’s Chip Packaging Service Needs TSMC is already servicing a facility in Taoyuan, northern Taiwan, and enclosures for chip packaging services are under construction next door to a 5nm facility in Tainan, south of the island. TSMC cannot replace all chip packaging manufacturers, but it expects to lure away the most demanding customers with large budgets.